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Green and Sustainable Manufacturing of Advanced Materials
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SYSNO ASEP 0463277 Document Type M - Monograph Chapter R&D Document Type Monograph Chapter Title Lead-Free Soldering: Environmentally Friendly Electronics Author(s) Kroupa, Aleš (UFM-A) RID, ORCID
Watson, A. (GB)
Mucklejohn, S. (GB)
Ipser, H. (AT)
Dinsdale, A. (GB)
Andersson, D. (SE)Number of authors 6 Source Title Green and Sustainable Manufacturing of Advanced Materials. - Amsterdam : Elsevier, 2016 / Singh M. ; Ohji T. ; Asthana R. - ISBN 978-0-12-411497-5 Pages s. 101-134 Number of pages 34 s. Number of copy 500 Number of pages 687 Publication form Print - P Language eng - English Country NL - Netherlands Keywords lead-free solders ; EU regulations ; high-temperature lead-free solders Subject RIV BJ - Thermodynamics Institutional support UFM-A - RVO:68081723 EID SCOPUS 84967110170 DOI 10.1016/B978-0-12-411497-5.09996-3 Annotation The substitution of lead in the electronics industry is one of the key issues in the current drive toward ecological manufacturing. This chapter is aimed at giving an overview of requirements, current situation, problems, and possible development of lead-free soldering and other environmentally friendly joining technologies. It starts with the overview of existing EU regulations and directives. The current situation in the lead-free soldering field is mapped here and a review of the literature, including a patent search, reveals systems and technologies that are at the focus of research effort. New approaches that employ the use of theoretical modeling in the development of new materials is briefly discussed in this chapter. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2017
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