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Multi-SWD plasma jet system for PECVD deposition of thin films
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SYSNO ASEP 0438735 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Multi-SWD plasma jet system for PECVD deposition of thin films Author(s) Olejníček, Jiří (FZU-D) RID, ORCID
Čada, Martin (FZU-D) RID, ORCID, SAI
Šmíd, Jiří (FZU-D)
Kment, Štěpán (FZU-D) RID, ORCID
Hubička, Zdeněk (FZU-D) RID, ORCID, SAISource Title IEEE Transactions on Plasma Science. - : Institute of Electrical and Electronics Engineers - ISSN 0093-3813
Roč. 42, č. 10 (2014), s. 2502-2503Number of pages 2 s. Language eng - English Country US - United States Keywords nuclear and plasma sciences ; plasma applications ; plasma devices ; plasmas Subject RIV BL - Plasma and Gas Discharge Physics R&D Projects TA01011740 GA TA ČR - Technology Agency of the Czech Republic (TA ČR) LH12045 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Institutional support FZU-D - RVO:68378271 UT WOS 000344548300089 EID SCOPUS 84908393981 DOI https://doi.org/10.1109/TPS.2014.2314214 Annotation Multiplasma jet surface-wave discharge launched by the surfatron is a promising PECVD tool for scalable deposition of various semiconductor materials. The timeresolved Langmuir probe study revealed that the plasma plume is inhomogeneous toward the substrate. In the measured interval, the electron energy and the plasma density increased with distance from the nozzle outlet. These findings allowed us to optimize the substrate position during the deposition process. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2015
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