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Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges
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SYSNO ASEP 0373839 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Growth and properties of Ti-Cu films with respect to plasma parameters in dual-magnetron sputtering discharges Author(s) Straňák, V. (DE)
Wulff, H. (DE)
Bogdanowicz, R. (DE)
Drache, S. (DE)
Hubička, Zdeněk (FZU-D) RID, ORCID, SAI
Čada, Martin (FZU-D) RID, ORCID, SAI
Tichý, M. (CZ)
Hippler, R. (DE)Source Title European Physical Journal D. - : Springer - ISSN 1434-6060
Roč. 64, 2-3 (2011), 427-435Number of pages 9 s. Language eng - English Country DE - Germany Keywords dual magnetron ; Ti-Cu film ; HiPIMS ; diagnostics ; ion energy Subject RIV BH - Optics, Masers, Lasers R&D Projects GAP205/11/0386 GA ČR - Czech Science Foundation (CSF) GP202/09/P159 GA ČR - Czech Science Foundation (CSF) KAN301370701 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR) 1M06002 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) CEZ AV0Z10100522 - FZU-D (2005-2011) UT WOS 000296630800029 DOI 10.1140/epjd/e2011-20393-7 Annotation Properties of different methods of magnetron sputtering (dc-MS, dual-MS and dual-HiPIMS) are studied and compared with respect to intermetallic Ti-Cu film formation. The quality and features of thin films are strongly influenced by the energy of incoming particles. The ion velocity distribution functions (IVDFs) were measured by time-resolved retarding field analyzer (RFA) in the substrate position. Thin films were characterized by X-ray photoelectron spectroscopy (XPS), X-ray diffractometry (XRD) and X-ray reflectometry (XR). It was found that IVDFs measured in pulsed discharges exhibit double-peak distribution. The IVDFs reach the maximum at ion energies about ~8 eV. The ion saturated current is highest in dual-HiPIMS discharge (~5 μA/cm2) and is mostly represented by Cu+ and Ar+ ions. The mode of sputtering influences chemical composition. The copper forms polycrystalline fcc-phase while much smaller Ti particles enwraps the copper crystallites or are part of a solid solution. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2012
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