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Thermodynamic reassessment of the Cu-Ni-Sn system
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SYSNO ASEP 0354176 Document Type A - Abstract R&D Document Type Není vybrán druh dokumentu Title Thermodynamic reassessment of the Cu-Ni-Sn system Author(s) Zemanová, Adéla (UFM-A) RID, ORCID
Kroupa, Aleš (UFM-A) RID, ORCIDSource Title TOFA 2010 (Thermodynamics of Alloys 2010). - Porto, 2010
S. 46-46Number of pages 1 s. Action TOFA 2010 (Thermodynamics of Alloys 2010) Event date 12.09.2010-16.09.2010 VEvent location Porto Country PT - Portugal Event type WRD Language eng - English Country PT - Portugal Keywords Cu-Ni-Sn system ; thermodynamic database ; lead-free soldering Subject RIV BJ - Thermodynamics CEZ AV0Z20410507 - UFM-A (2005-2011) Annotation The Cu-Ni-Sn system plays a crucial role in lead-free soldering and therefore, it is important to have its reliable description. The existing assessment of ternary Cu-Ni-Sn system published by Miettien has to be remodelled to include the newest results for binary and ternary systems. New extensive experimental results published by Schmetterer at al. and original results published in were used for the reassessment. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2011
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