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Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation
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SYSNO ASEP 0308150 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Influence of substrate material on plasma in deposition/sputtering reactor: experiment and computer simulation Title Vliv vzorku na plazma v depozičním/odprašovacím reaktoru: experiment a počítačová simulace Author(s) Brzobohatý, Oto (UPT-D) RID, ORCID, SAI
Buršíková, V. (CZ)
Nečas, D. (CZ)
Valtr, M. (CZ)
Trunec, D. (CZ)Source Title Journal of Physics D-Applied Physics. - : Institute of Physics Publishing - ISSN 0022-3727
Roč. 41, č. 3 (2008), 035213:1-8Number of pages 8 s. Language eng - English Country GB - United Kingdom Keywords r. f. plasma ; computer simulation ; secondary electron emision ; plasma deposition ; plasma sputtering Subject RIV BL - Plasma and Gas Discharge Physics R&D Projects GA202/07/1669 GA ČR - Czech Science Foundation (CSF) CEZ AV0Z20650511 - UPT-D (2005-2011) UT WOS 000253177800036 DOI 10.1088/0022-3727/41/3/035213 Annotation The aim of the present work was to investigate the influence of the substrate material on the plasma enhanced chemical vapor deposition and the plasma sputtering of thin films in low pressure parallel-plate r.f. discharges. It was observed that the deposition or sputtering rates differed above different materials, e.g., above a substrate and substrate electrode. Moreover, the substrates placed on the bottom r.f. electrode seemed to be mirrored in the thickness of a thin film deposited or sputtered on the upper grounded electrode. The influence of the substrate material on the plasma parameters was studied via Particle In Cell/Monte Carlo computer simulation. According to our finding the mirroring of the substrate was caused by different secondary electron emission yields of the substrate material and material of the substrate electrode. Workplace Institute of Scientific Instruments Contact Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Year of Publishing 2008
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