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Mechanism of the film composition formation during magnetron sputtering of WTi

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    SYSNO ASEP0185385
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JOstatní články
    TitleMechanism of the film composition formation during magnetron sputtering of WTi
    Author(s) Shaginyan, L. R. (UA)
    Mišina, M. (CZ)
    Kadlec, S. (CZ)
    Jastrabík, L. (CZ)
    Macková, Anna (UJF-V) RID, ORCID, SAI
    Peřina, Vratislav (UJF-V) RID
    Source TitleJournal of Vacuum Science & Technology A : Vacuum, Surfaces and Films. - : AIP Publishing - ISSN 0734-2101
    Roč. 19, č. 5 (2001), s. 2554-2566
    Number of pages13 s.
    Languageeng - English
    CountryUS - United States
    Subject RIVBG - Nuclear, Atomic and Molecular Physics, Colliders
    R&D ProjectsGV202/97/K038 GA ČR - Czech Science Foundation (CSF)
    KSK1010104 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
    AnnotationThe WTi films were deposited by an unbalanced magnetron sputtering of a WTi (70:30 at. %) alloy target. The influence of the working gas (Ar) pressure, substrate bias, and substrate location on the composition of films was studied. The films deposited at low working gas pressures (<1 Pa) onto electrically floating substrates were largely depleted in Ti while the composition of films deposited at high argon pressure (25 Pa) was close to that of the target. The ion bombardment of the growing film resulted in a decreaseof the Ti content in the films. The composition of the films deposited simultaneously onto a pair of substrates placed at the axis and at the periphery of the target did not depend on the substrate position at both low and high pressure.
    WorkplaceNuclear Physics Institute
    ContactMarkéta Sommerová, sommerova@ujf.cas.cz, Tel.: 266 173 228
    Year of Publishing2002

Number of the records: 1  

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