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Fatigue strength, microstructural stability and strain localization in ultrafine-grained copper
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SYSNO ASEP 0043862 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Ostatní články Title Fatigue strength, microstructural stability and strain localization in ultrafine-grained copper Title Únavová pevnost, mikrostrukturní stabilita a lokalizace deformace ultrajemnozrnné mědi Author(s) Kunz, Ludvík (UFM-A) RID, ORCID
Lukáš, Petr (UFM-A)
Svoboda, Milan (UFM-A) RID, ORCIDSource Title Materials Science and Engineering A Structural Materials Properties Microstructure and Processing. - : Elsevier - ISSN 0921-5093
A 424, 1-2 (2006), s. 97-104Number of pages 8 s. Language eng - English Country CH - Switzerland Keywords ultrafine-grained microstructure ; ECAP ; fatigue Subject RIV JG - Metallurgy R&D Projects 1QS200410502 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR) 1P05ME804 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) CEZ AV0Z20410507 - UFM-A (2005-2011) Annotation Fatigue lifetime under stress control of ultrafine-grained Cu of 99.9 % purity prepared by equal channel angular pressing has been shown to exceed that of conventionally-grained cold worked counterparts by a factor of 1.7 in low-, high- and very-high-cycle region. The electron back scattering diffraction technique did not reveal changes of bulk microstructure due to cyclic loading. Minor changes of dislocation microstructure were detected by transmission electron microcopy. Qualitative change from moderate cyclic hardening to cyclic softening was observed with increasing stress amplitude. Comparison of S-N data with those available in literature shows substantially higher lifetime of material studied in this work in the high-cycle and very-high-cycle region. This effect is attributed to high stability of grain structure and lower purity of the examined ultrafine-grained copper. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2007
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