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Enhanced creep properties of copper and its alloys processed by ECAP
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SYSNO ASEP 0435683 Document Type C - Proceedings Paper (int. conf.) R&D Document Type Conference Paper Title Enhanced creep properties of copper and its alloys processed by ECAP Author(s) Dvořák, Jiří (UFM-A) RID, ORCID
Král, Petr (UFM-A) RID, ORCID
Svoboda, Milan (UFM-A) RID, ORCID
Kvapilová, Marie (UFM-A) RID, ORCID
Sklenička, Václav (UFM-A) RID, ORCIDNumber of authors 5 Source Title NANOSPD 6. - Bristol : IOP Publishing Ltd, 2014 / S.T. ; Benoît B. ; Olivier B. ; Emmanuel B. ; Thierry G. - ISSN 1757-8981 Pages art. no. 012141 Number of pages 8 s. Publication form Online - E Action NanoSPD 2014 - International Conference on Nanomaterials by Severe Plastic Deformation /6/ Event date 30.06.2014-04.07.2014 VEvent location Metz Country FR - France Event type WRD Language eng - English Country GB - United Kingdom Keywords Copper alloys ; Creep ; Microstructure ; UFG materials Subject RIV JJ - Other Materials R&D Projects GAP108/11/2260 GA ČR - Czech Science Foundation (CSF) ED1.1.00/02.0068 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Institutional support UFM-A - RVO:68081723 UT WOS 000347246200142 EID SCOPUS 84906330748 DOI 10.1088/1757-899X/63/1/012141 Annotation This work describes the effect of ECAP technique on the microstructure and creep properties of pure Cu and its alloys with addition of Zr or Co. The ECAP pressing was performed at room temperature by route Bc up to 12 passes. Ultrafine-grained (UFG) microstructure has been studied by methods of TEM and SEM-EBSD. Tensile creep tests were conducted at temperature 673 K and at different applied stresses on ECAP material and, for comparison purposes, on unpressed coarse-grained (CG) states. It was found that both alloys processed by ECAP exhibited similar character of creep behaviour. Creep resistance was markedly improved after first two ECAP passes in comparison with its unpressed state. The minimum creep rate of ECAP material may be up to two orders of magnitude lower than that of CG material. However, subsequent ECAP passes lead to a decline of creep life and the difference in the minimum creep rate for the ECAP material and CG state consistently decreases with increasing number of ECAP passes. Further, ECAP process led to significant improvements in fracture strain. The link between microstructural processes and creep behaviour of pressed Cu and its selected alloys is examined in detail. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2015
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