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(Gd,Y,Er)Ba.sub.2./sub.Cu.sub.3./sub.O.sub.y./sub. bulk superconducting system processed via infiltration growth
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SYSNO ASEP 0543594 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title (Gd,Y,Er)Ba2Cu3Oy bulk superconducting system processed via infiltration growth Author(s) Pinmangkorn, S. (JP)
Miryala, M. (JP)
Arvapalli, S.S. (JP)
Jirsa, Miloš (FZU-D) RID, ORCID
Oka, T. (JP)
Sakai, N. (JP)
Murakami, M. (JP)Number of authors 7 Article number 160535 Source Title Journal of Alloys and Compounds. - : Elsevier - ISSN 0925-8388
Roč. 881, Nov (2021)Number of pages 9 s. Language eng - English Country NL - Netherlands Keywords (Gd,Y,Er)-123 ; (Gd,Y,Er)-211 ; ternary bulk superconductor ; infiltration growth Subject RIV BM - Solid Matter Physics ; Magnetism OECD category Condensed matter physics (including formerly solid state physics, supercond.) Method of publishing Limited access Institutional support FZU-D - RVO:68378271 UT WOS 000665784800003 EID SCOPUS 85108143012 DOI 10.1016/j.jallcom.2021.160535 Annotation Ternary bulk REBa2Cu3Oy superconductors processed via oxygen-controlled melt growth (OCMG) have exhibited superior superconducting properties with respect to binary and single systems. However, the OCMG process is rather complicated, expensive, and difficult to scale-up into industrial level. To overcome these issues, we have studied the yet unexplored ternary bulk (Gd,Y,Er)Ba2Cu3Oy “(Gd,Y,Er)-123″ system, fabricated via trendy infiltration growth (IG) process. We studied the effect of varying Y-211 and Er-211 ratio (Gd: Y: Er = 0.33: 0.33-x: 0.33+x, where x = 0, 0.05, 0.1, 0.15 and 0.2) in the preform on the final superconducting properties and microstructure. We succeeded to fabricate (Gd,Y,Er)-123 single-grain bulks (diameter – 20 mm). The critical current density (Jc) and trapped field increased proportionally with the increased amount of Er-211 in the preform. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2022 Electronic address https://doi.org/10.1016/j.jallcom.2021.160535
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