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Process Maps for Plasma Spray. Part II:Deposition and Properties
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SYSNO ASEP 0178833 Document Type A - Abstract R&D Document Type The record was not marked in the RIV R&D Document Type Není vybrán druh dokumentu Title Process Maps for Plasma Spray. Part II:Deposition and Properties Author(s) Jiang, X. (US)
Matějíček, Jiří (UFP-V) RID, ORCID
Kulkarni, A. (US)
Herman, H. (US)
Sampath, S. (US)
Gilmore, D. (US)
Neiser, R. (US)Source Title Thermal Spray:Surface Engineering via Applied Research, Thermal Spray:Surface Engineering via Applied Research. / Berndt C.C.. - Ohio : ASM Materials Park, 2000 - ISBN 0-87170-680-6
s. 157-163Number of pages 7 s. Action International Thermal Spray Conference/1st./ Event date 08.05.2000-11.05.2000 VEvent location Montreal Country CA - Canada Language eng - English Country US - United States Subject RIV JG - Metallurgy R&D Projects NSF DMR9632570(US) GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR) CEZ AV0Z2043910 - UFP-V Annotation This is the second paper of a two part series based on anintegrated study carried out the State University of New York at Stony Brook and Sandia National Laboratories.The aim the study is the fundamental understanding of the plasma-particle interaction,droplet substrate interaction,deposit formation dynamics and microstructure development as well as the deposit property.The purpose is to develop relationships,which can used to link processing to perfor Workplace Institute of Plasma Physics Contact Vladimíra Kebza, kebza@ipp.cas.cz, Tel.: 266 052 975 Year of Publishing 2001
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