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Process Maps for Plasma Spray. Part II:Deposition and Properties

  1. 1.
    SYSNO ASEP0178833
    Document TypeA - Abstract
    R&D Document TypeThe record was not marked in the RIV
    R&D Document TypeNení vybrán druh dokumentu
    TitleProcess Maps for Plasma Spray. Part II:Deposition and Properties
    Author(s) Jiang, X. (US)
    Matějíček, Jiří (UFP-V) RID, ORCID
    Kulkarni, A. (US)
    Herman, H. (US)
    Sampath, S. (US)
    Gilmore, D. (US)
    Neiser, R. (US)
    Source TitleThermal Spray:Surface Engineering via Applied Research, Thermal Spray:Surface Engineering via Applied Research. / Berndt C.C.. - Ohio : ASM Materials Park, 2000 - ISBN 0-87170-680-6
    s. 157-163
    Number of pages7 s.
    ActionInternational Thermal Spray Conference/1st./
    Event date08.05.2000-11.05.2000
    VEvent locationMontreal
    CountryCA - Canada
    Languageeng - English
    CountryUS - United States
    Subject RIVJG - Metallurgy
    R&D ProjectsNSF DMR9632570(US) GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
    CEZAV0Z2043910 - UFP-V
    AnnotationThis is the second paper of a two part series based on anintegrated study carried out the State University of New York at Stony Brook and Sandia National Laboratories.The aim the study is the fundamental understanding of the plasma-particle interaction,droplet substrate interaction,deposit formation dynamics and microstructure development as well as the deposit property.The purpose is to develop relationships,which can used to link processing to perfor
    WorkplaceInstitute of Plasma Physics
    ContactVladimíra Kebza, kebza@ipp.cas.cz, Tel.: 266 052 975
    Year of Publishing2001

Number of the records: 1  

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