Novel Ti–Si–C composites for SOFC interconnect materials: Production optimization

Tkachenko, S.; Brodnikovskyi, D.; Čížek, Jan; Komarov, P.; Brodnikovskyi, Y.; Tymoshenko, Y.; Csáki, Štefan; Pinchuk, M.; Vasylyev, O.; Čelko, L.; Gadzyra, M.; Chráska, Tomáš

doi:https://dx.doi.org/10.1016/j.ceramint.2022.06.081

Number of the records: 1

Novel Ti–Si–C composites for SOFC interconnect materials: Production optimization

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SYSNO ASEP	0565839
Document Type	J - Journal Article
R&D Document Type	Journal Article
Subsidiary J	Článek ve WOS
Title	Novel Ti–Si–C composites for SOFC interconnect materials: Production optimization
Author(s)	Tkachenko, S. (CZ) Brodnikovskyi, D. (UA) Čížek, Jan (UFP-V)_ORCID Komarov, P. (CZ) Brodnikovskyi, Y. (UA) Tymoshenko, Y. (UA) Csáki, Štefan (UFP-V)_ORCID Pinchuk, M. (UA) Vasylyev, O. (UA) Čelko, L. (CZ) Gadzyra, M. (UA) Chráska, Tomáš (UFP-V)_{RID, ORCID}
Number of authors	12
Source Title	Ceramics International. - : Elsevier - ISSN 0272-8842 Roč. 48, č. 19 (2022), s. 27785-27798
Number of pages	14 s.
Language	eng - English
Country	GB - United Kingdom
Keywords	Electrical resistance ; Flexural strength ; SOFC interconnect ; Spark plasma sintering ; Ti-Si-C composite
Subject RIV	JG - Metallurgy
OECD category	Materials engineering
Method of publishing	Limited access
Institutional support	UFP-V - RVO:61389021
UT WOS	000848559300004
EID SCOPUS	85132540589
DOI	10.1016/j.ceramint.2022.06.081
Annotation	This paper presents a first part of research of designing a new Ti–Si–C-based composite for potential application as a solid oxide fuel cells interconnect material. Spark plasma sintering technique was used for the production and the effects of sintering parameters on microstructure, phase composition, as well as mechanical and electrical properties were investigated. Optimization of the sintering conditions then allowed to obtain a fine-grained material with properties (bending strength 433 MPa, hardness of 9.6 GPa, electrical resistance 26 mΩ cm) surpassing those of Crofer steels, materials typically used in the SOFC interconnect applications nowadays. This is a very promising result, yielding our Ti–Si–C composite a serious candidate for new-generation lightweight interconnect materials.
Workplace	Institute of Plasma Physics
Contact	Vladimíra Kebza, kebza@ipp.cas.cz, Tel.: 266 052 975
Year of Publishing	2023
Electronic address	https://www.sciencedirect.com/science/article/pii/S0272884222020739?via%3Dihub

Number of the records: 1