In-Situ Testing and Heterogeneity of UFG Cu at Elevated Temperatures

0450289 - ÚFM 2016 RIV CH eng C - Conference Paper (international conference)
Petrenec, M. - Král, Petr - Dvořák, Jiří - Svoboda, Milan - Sklenička, Václav
In-Situ Testing and Heterogeneity of UFG Cu at Elevated Temperatures.
COMAT 2014 - Recent Trends in Structural Materials. Zurich: Trans Tech Publications, 2015 - (Džugan, J.; Nový, Z.), s. 67-72. Advanced Materials Research, 1127. ISBN 978-3-03835-623-3.
[COMAT 2014 - International Conference COMAT on Recent Trends in Structural Materials /3./. Plzeň (CZ), 19.11.2015-21.11.2015]
R&D Projects: GA ČR(CZ) GAP108/11/2260
Institutional support: RVO:68081723
Keywords : In-situ testing * heterogeneity * creep behaviour * EBSD
Subject RIV: JJ - Other Materials

Experiments were conducted to investigate deformation-induced processes during in-situ tensile test at elevated temperature. Consequently the microstructure after creep loading was examined by 3D Electron Back Scatter Diffraction (EBSD) technique. The billets of coarse-grained copper were processed by ECAP at room temperature by route Bc by 8 ECAP passes. The constant strain-rate test in tension was performed at 473 K using testing GATAN stage Microtest 2000EW with EH 2000 heated grips which is configured for in-situ electron back scatter diffraction (EBSD) observations. Microstructure was examined by FEG-SEM TESCAN MIRA 3 XM equipped by EBSD detector HKL NordlysMax from OXFORD INSTRUMENT. The tensile test was interrupted by fast stress reductions after different deformation step and observation of microstructure changes was performed. In the present work was found that ultrafine-grained microstructure is instable and significant grain growth has already occurred during heating to the testing temperature. Static recrystallization during heating led to the formation of high fraction of special boundaries Σ3 and Σ9. The tensile deformation at 473 K led to the additional grain growth and formation of new grains.
Permanent Link: http://hdl.handle.net/11104/0252063