Number of the records: 1  

Design of Setup for Laser Induced Plasma Etching

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    SYSNO ASEP0617414
    Document TypeC - Proceedings Paper (int. conf.)
    R&D Document TypeConference Paper
    TitleDesign of Setup for Laser Induced Plasma Etching
    Author(s) Šilhan, Lukáš (UPT-D)
    Novotný, Jan (UPT-D) ORCID, SAI, RID
    Plichta, Tomáš (UPT-D) ORCID, SAI
    Ježek, Jan (UPT-D) RID, ORCID, SAI
    Vaculík, Ondřej (UPT-D)
    Šerý, Mojmír (UPT-D) RID, SAI
    Number of authors6
    Source Title2024 37th International Vacuum Nanoelectronics Conference, IVNC 2024. - New York : IEEE, 2024 - ISSN 2164-2370 - ISBN 979-8-3503-7977-8
    Pagess. 44-45
    SeriesInternational Vacuum Nanoelectronics Conference
    Number of pages2 s.
    Publication formPrint - P
    ActionInternational Vacuum Nanoelectronics Conference (IVNC) /37./
    Event date15.07.2024 - 19.07.2024
    VEvent locationBrno
    CountryCZ - Czech Republic
    Event typeWRD
    Languageeng - English
    CountryUS - United States
    Keywordsvacuum chamber ; plasma etching ; femtosecond laser ; micromachining ; three-dimensional displays ; lithography ; electronics industry ; surface emitting lasers ; ignition
    Subject RIVBH - Optics, Masers, Lasers
    OECD categoryOptics (including laser optics and quantum optics)
    R&D ProjectsTN02000020 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
    Institutional supportUPT-D - RVO:68081731
    UT WOS001310530600005
    EID SCOPUS85204066231
    DOI https://doi.org/10.1109/IVNC63480.2024.10652276
    AnnotationPlasma etching introduces a physically activated chemical process highly utilized in the semiconductor industry. However, for the creation of etched structures mask has to be prepared on top of the etched surfaces. This is usually achieved by electron beam lithography, which adds to the complexity and financial demands of the overall process. We present the design of a setup for maskless plasma etching, which utilizes a tightly focused ultrashort laser pulse for the ignition of etching plasma in a custom vacuum chamber with a connection to a gas-containing etching species. In addition, etched structures are written into the surface of sample by scanning with the vacuum chamber with relation to fixed laser focus. This enables maskless 3D etching of samples with a less complicated technological process.
    WorkplaceInstitute of Scientific Instruments
    ContactMartina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178
    Year of Publishing2025
    Electronic addresshttps://ieeexplore.ieee.org/document/10652276
Number of the records: 1  

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