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Low conductive thermal insulation pad with high mechanical stiffness
- 1.HANZELKA, P., DUPÁK, L., KRUTIL, V., KRZYŽÁNEK, V., SKOUPÝ, R., SRNKA, A., VLČEK, I., URBAN, P. Low conductive thermal insulation pad with high mechanical stiffness. In: KRZYŽÁNEK, V., HRUBANOVÁ, K., HOZÁK, P., MÜLLEROVÁ, I., ŠLOUF, M., eds. 16th Multinational Congress on Microscopy, 16MCM, 04-09 September 2022, Brno, Czech Republic. Book of abstracts. Brno: Czechoslovak Microscopy Society, 2022, s. 152-153. ISBN 978-80-11-02253-2. Available: https://www.16mcm.cz/wp-content/uploads/2022/09/16MCM-abstract-book.pdf
Number of the records: 1