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Lift-off technology for thick metallic microstructures

  1. 1.
    SYSNO0485656
    TitleLift-off technology for thick metallic microstructures
    Author(s) Krátký, Stanislav (UPT-D) RID, ORCID, SAI
    Horáček, Miroslav (UPT-D) RID, ORCID, SAI
    Meluzín, Petr (UPT-D) RID, ORCID, SAI
    Kolařík, Vladimír (UPT-D) RID, ORCID, SAI
    Matějka, Milan (UPT-D) RID, ORCID, SAI
    Oulehla, Jindřich (UPT-D) RID, ORCID, SAI
    Pesic, Z. (GB)
    Source Title METAL 2017. 26th International Conference on Metallurgy and Materials. Conference Proceedings. S. 1298-1302. - Ostrava : TANGER, 2017
    Conference METAL 2017: International Conference on Metallurgy and Materials /26./, 24.05.2017, Brno - 26.05.2017
    Document TypeKonferenční příspěvek (zahraniční konf.)
    Grant TE01020233 GA TA ČR - Technology Agency of the Czech Republic (TA ČR)
    LO1212 GA MŠMT - Ministry of Education, Youth and Sports (MEYS), CZ - Czech Republic
    ED0017/01/01 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
    Institutional supportUPT-D - RVO:68081731
    Languageeng
    CountryCZ
    Keywords lift-off technique * SU-8 photoresist * e-beam lithography * thick layer evaporation
    Permanent Linkhttp://hdl.handle.net/11104/0280633
     
Number of the records: 1  

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