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Lift-off technology for thick metallic microstructures
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SYSNO ASEP 0485656 Document Type C - Proceedings Paper (int. conf.) R&D Document Type Conference Paper Title Lift-off technology for thick metallic microstructures Author(s) Krátký, Stanislav (UPT-D) RID, ORCID, SAI
Horáček, Miroslav (UPT-D) RID, ORCID, SAI
Meluzín, Petr (UPT-D) RID, ORCID, SAI
Kolařík, Vladimír (UPT-D) RID, ORCID, SAI
Matějka, Milan (UPT-D) RID, ORCID, SAI
Oulehla, Jindřich (UPT-D) RID, ORCID, SAI
Pesic, Z. (GB)Number of authors 7 Source Title METAL 2017. 26th International Conference on Metallurgy and Materials. Conference Proceedings. - Ostrava : TANGER, 2017 - ISBN 978-80-87294-79-6 Pages s. 1298-1302 Number of pages 5 s. Publication form Medium - C Action METAL 2017: International Conference on Metallurgy and Materials /26./ Event date 24.05.2017 - 26.05.2017 VEvent location Brno Country CZ - Czech Republic Event type WRD Language eng - English Country CZ - Czech Republic Keywords lift-off technique ; SU-8 photoresist ; e-beam lithography ; thick layer evaporation Subject RIV JA - Electronics ; Optoelectronics, Electrical Engineering OECD category Coating and films R&D Projects TE01020233 GA TA ČR - Technology Agency of the Czech Republic (TA ČR) LO1212 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) ED0017/01/01 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Institutional support UPT-D - RVO:68081731 UT WOS 000434346900208 Annotation This paper deals with a method enabling the preparation of thick metallic microstructures on metal substrates. Such metallic microstructures can be used as a resolution samples to characterize various microanalysis techniques, such as X-ray fluorescence (XRF) or X-ray photoelectron spectroscopy (XPS). Moreover, the
patterned samples could be used as anodes to characterize focusing properties of X-ray tubes for micro CT systems. Considering that the standard lift-off technique is designated for structures with the thickness of several hundred nanometers at most, we had to modify lift-off technique to be possible to use it for preparation of very thick metal layers (several microns) with spatial resolution of a few microns. The mask with the desired pattern for UV exposure was prepared by e-beam lithography. SU-8 photoresist was used for a lift-off because of its aspect ratio ability, process purity and high resistance to heating. We used a thin layer of PMMA under the SU-8 masking layer to guarantee the photoresist would lift-off correctly. Thick aluminum layer was deposited by thermal evaporation. The dependence of metal layer thickness as a function of required exposed
line width was determined. The final lift-off process was carried out in acetone ultrasonic bath. Generally, this technology can be used for the evaporate deposition of various materials with several microns thick layer in
micron resolution.Workplace Institute of Scientific Instruments Contact Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Year of Publishing 2018
Number of the records: 1