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Novel complexes of Co2+, Ni2+, and Cu2+ with N-(phosphonomethyl)aminosuccinic acid
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SYSNO ASEP 0392657 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Novel complexes of Co2+, Ni2+, and Cu2+ with N-(phosphonomethyl)aminosuccinic acid Author(s) Trunova, O. K. (UA)
Shovkova, G. V. (UA)
Gerasimchuk, A. I. (UA)
Večerníková, Eva (UACH-T) SAI
Bezdička, Petr (UACH-T) SAI, RID, ORCID
Šubrt, Jan (UACH-T) SAI, RIDSource Title Journal of Thermal Analysis and Calorimetry. - : Akadémiai Kiadó - ISSN 1388-6150
Roč. 115, č. 1 (2014), s. 697-706Number of pages 10 s. Language eng - English Country HU - Hungary Keywords Carboxyphosphonate ; N-(phosphonomethyl)aminosuccinic acid ; Thermal decomposition Subject RIV CA - Inorganic Chemistry Institutional support UACH-T - RVO:61388980 UT WOS 000329621100084 EID SCOPUS 84877619284 DOI 10.1007/s10973-013-3191-3 Annotation Complexes of Co2?, Ni2 ?, and Cu2? with N-(phosphonomethyl)aminosuccinic acid (H4PMAS) of general formula Na2MPMAS nH2O [M=Co(II), Ni(II), Cu(II), n—number of water molecules] were synthesized. Based on interpretation of diffusion reflectance spectroscopy, structure of all complexes is based on distorted octahedral. Analysis of IR spectra of Co(II), Ni(II), and Cu(II) N-(phosphonomethyl)aminosuccinates demonstrated that metal ions are coordinated to the ligand through nitrogen atom of the imino group, oxygen atoms of the aand b-carboxyl groups as well as oxygen atom of the phosphonic group of the H4PMAS. We demonstrated that thermal stability of complexes increases in sequence Cu(II)/Ni(II)/Co(II), obviously as a result of change over from the dimeric to polymeric character of the initial complex. Complete decomposition of ligand occurs at these temperatures and is accompanied by release of H2O, CO2, and NO2. The final products of thermal decomposition of the complexes are mixtures of oxides and phosphates of respective metals. Workplace Institute of Inorganic Chemistry Contact Jana Kroneislová, krone@iic.cas.cz, Tel.: 311 236 931 Year of Publishing 2014
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