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Automated system for optical inspection of defects in resist coated non-patterned wafer.
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SYSNO ASEP 0512149 Document Type A - Abstract R&D Document Type The record was not marked in the RIV R&D Document Type Není vybrán druh dokumentu Title Automated system for optical inspection of defects in resist coated non-patterned wafer. Author(s) Knápek, Alexandr (UPT-D) RID, ORCID, SAI
Drozd, Michal (UPT-D)
Matějka, Milan (UPT-D) RID, ORCID, SAI
Chlumská, Jana (UPT-D) RID, ORCID, SAI
Král, Stanislav (UPT-D) RID, SAI
Kolařík, Vladimír (UPT-D) RID, ORCID, SAINumber of authors 6 Source Title Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4). Book of Abstracts. - Amman : Jordan University of Science & Technology, 2019 Number of pages 1 s. Publication form Print - P Action The Fourth International Symposium on Dielectric Materials and Applications (ISyDMA 4) Event date 02.05.2019 - 04.05.2019 VEvent location Amman Country JO - Jordan Event type WRD Language eng - English Country JO - Jordan Keywords dielectric surface inspection ; resist coated wafer Subject RIV JA - Electronics ; Optoelectronics, Electrical Engineering R&D Projects FV10618 GA MPO - Ministry of Industry and Trade (MPO) Institutional support UPT-D - RVO:68081731 Annotation Quality control of the resist coating on the silicon wafer is one of the major task prior the exposition of patterns into the resist layer. Thus, the ability to inspect and identify the physical defect in the resist layer plays an important role. The absence of any unwanted defect in resist is an ultimate requirement for preparation of precise and functional micro- or nano-patterned surfaces. Currently used wafer inspection systems is mostly used in semiconductor or microelectronic industry to inspect non-patterned or patterned wafers (integrated circuits, photomasks, MEMS, etc.) in order to achieve production with high yield. Typically, they are based on acoustic micro imaging, optical imaging or electron microscopy. This paper presents design of a custom optical based inspection device for small batch lithography production that allows scanning a wafer surface with an optical camera and by analyzing the captured images to determine the coordinates (X, Y), size and type of the defects in the resist layer. In addition, a software that is responsible for driving the scanning device and for advanced image processing is presented. Workplace Institute of Scientific Instruments Contact Martina Šillerová, sillerova@ISIBrno.Cz, Tel.: 541 514 178 Year of Publishing 2020
Number of the records: 1