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Near threshold fatigue crack growth in ultrafine-grained copper
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SYSNO ASEP 0484637 Document Type C - Proceedings Paper (int. conf.) R&D Document Type Conference Paper Title Near threshold fatigue crack growth in ultrafine-grained copper Author(s) Arzaghi, M. (FR)
Fintová, S. (CZ)
Sarrazin-Baudoux, C. (FR)
Kunz, Ludvík (UFM-A) RID, ORCID
Petit, J. (CZ)Number of authors 5 Article number UNSP 012158 Source Title 6TH INTERNATIONAL CONFERENCE ON NANOMATERIALS BY SEVERE PLASTIC DEFORMATION (NANOSPD6). - Bristol : IOP PUBLISHING LTD, 2014 - ISSN 1757-8981 Number of pages 9 s. Publication form Online - E Action NanoSPD6 - International Conference on Nanomaterials by Severe Plastic Deformation /6./ Event date 30.06.2014 - 04.07.2014 VEvent location Metz Country FR - France Event type EUR Language eng - English Country GB - United Kingdom Keywords SEVERE PLASTIC-DEFORMATION ; BEHAVIOR ; ALLOYS ; METALS Subject RIV JL - Materials Fatigue, Friction Mechanics OECD category Audio engineering, reliability analysis R&D Projects GAP108/10/2001 GA ČR - Czech Science Foundation (CSF) Institutional support UFM-A - RVO:68081723 UT WOS 000347246200159 DOI 10.1088/1757-899X/63/1/012158 Annotation The near threshold fatigue crack growth in ultrafine-grained (UFG) copper at room temperature was studied in comparison to conventional coarse-grained (CG) copper. The fatigue crack growth rates da/dN in UFG copper were enhanced at Delta K <= 7 MPa root m compared to the CG material. The crack closure shielding, as evaluated using the compliance variation technique, was shown to explain these differences. The effective stress intensity factor amplitude Delta K-eff appears to be the same driving force in both materials. Tests performed in high vacuum on UFG copper demonstrate the existence of a huge effect of environment with growth rates higher of about two orders of magnitude in air compared to high vacuum. This environmental effect on the crack path and the related microstructure is discussed on the basis of fractography observations performed using scanning electron microscope and completed with field emission scanning electron microscope combined with the focused ion beam technique. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2018
Number of the records: 1