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Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films
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SYSNO ASEP 0572409 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films Author(s) Antony, A. (CZ)
Hejduk, M. (CZ)
Hrbek, T. (CZ)
Kúš, P. (CZ)
Bičišťová, Radka (FZU-D) ORCID
Hauschwitz, Petr (FZU-D) ORCID
Cvrček, L. (CZ)Number of authors 7 Article number 157276 Source Title Applied Surface Science. - : Elsevier - ISSN 0169-4332
Roč. 627, Aug. (2023)Number of pages 7 s. Language eng - English Country NL - Netherlands Keywords glass ; glass metallization ; laser treatment ; surface adhesion ; microstructure Subject RIV BH - Optics, Masers, Lasers OECD category Optics (including laser optics and quantum optics) R&D Projects EF15_006/0000674 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Method of publishing Limited access Institutional support FZU-D - RVO:68378271 UT WOS 000988755400001 EID SCOPUS 85153573521 DOI 10.1016/j.apsusc.2023.157276 Annotation We report a simple and efficient two-step experimental procedure of glass metallization using laser microstructuring at ambient conditions. An adhesive pattern was created on the glass substrate using a laser, which imposes mechanical interlocking. An adhesive Cu layer was deposited on the glass substrate by magnetron sputtering and then electroplated with a functional Cu layer. Due to the unique surface structure created on the glass using laser, we achieved a thick layer of Cu metal film with high adhesion strength, well-defined grains and grain boundaries, and low surface roughness. The total thickness of the grown film was 11.4 µm, with an average surface roughness of 1.2 µm. The magnetron-sputtered coating did not show delamination from the glass substrate at a critical load of 60 N. The proposed method of glass metallization will lead to the realization of glass-based circuit materials that can be used in high-frequency electronic devices. Also, this procedure will be an alternative to chemical-based copper plating, which involves multiple processing steps and high-cost chemicals. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2024 Electronic address https://doi.org/10.1016/j.apsusc.2023.157276
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