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Ultrahigh temperature flash sintering of binder-less tungsten carbide within 6 s
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SYSNO ASEP 0567548 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Ultrahigh temperature flash sintering of binder-less tungsten carbide within 6 s Author(s) Deng, H. (CN)
Biesuz, Mattia (UFP-V)
Vilémová, Monika (UFP-V) RID, ORCID
Kermani, M. (CN)
Veverka, Jakub (UFP-V) ORCID
Tyrpekl, V. (CZ)
Hu, C. (CN)
Grasso, S. (CN)Number of authors 8 Article number 7655 Source Title Materials. - : MDPI
Roč. 14, č. 24 (2021)Number of pages 11 s. Language eng - English Country CH - Switzerland Keywords Tungsten carbide ; Ultrahigh temperature flash sintering ; Ultrarapid consolidation Subject RIV JP - Industrial Processing OECD category Materials engineering Method of publishing Open access Institutional support UFP-V - RVO:61389021 UT WOS 000738460400001 EID SCOPUS 85121311021 DOI 10.3390/ma14247655 Annotation We report on an ultrarapid (6 s) consolidation of binder-less WC using a novel Ultrahigh temperature Flash Sintering (UFS) approach. The UFS technique bridges the gap between electric resistance sintering (≪1 s) and flash spark plasma sintering (20–60 s). Compared to the well-established spark plasma sintering, the proposed approach results in improved energy efficiency with massive energy and time savings while maintaining a comparable relative density (94.6%) and Vickers hardness of 2124 HV. The novelty of this work relies on (i) multiple steps current discharge profile to suit the rapid change of electrical conductivity experienced by the sintering powder, (ii) upgraded low thermal inertia CFC dies and (iii) ultra-high consolidation temperature approaching 2750◦C. Compared to SPS process, the UFS process is highly energy efficient (≈200 times faster and it consumes ≈95% less energy) and it holds the promise of energy efficient and ultrafast consolidation of several conductive refractory compounds. Workplace Institute of Plasma Physics Contact Vladimíra Kebza, kebza@ipp.cas.cz, Tel.: 266 052 975 Year of Publishing 2023 Electronic address https://www.mdpi.com/1996-1944/14/24/7655
Number of the records: 1