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Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO.sub.2./sub. matrix
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SYSNO ASEP 0510812 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO2 matrix Author(s) Straňák, V. (CZ)
Drache, S. (DE)
Wulff, H. (DE)
Hubička, Zdeněk (FZU-D) RID, ORCID, SAI
Tichý, M. (CZ)
Kruth, A. (DE)
Helm, Ch.A. (DE)
Hippler, R. (DE)Number of authors 8 Source Title Thin Solid Films. - : Elsevier - ISSN 0040-6090
Roč. 589, Aug (2015), s. 864-871Number of pages 8 s. Language eng - English Country CH - Switzerland Keywords copper ; nanocomposite ; nanoparticles ; oxidation ; sputtering ; titanium dioxide matrix Subject RIV BL - Plasma and Gas Discharge Physics OECD category Fluids and plasma physics (including surface physics) R&D Projects GAP108/12/2104 GA ČR - Czech Science Foundation (CSF) Method of publishing Limited access Institutional support FZU-D - RVO:68378271 UT WOS 000360320000136 EID SCOPUS 84940062502 DOI 10.1016/j.tsf.2015.07.026 Annotation Metal nanoparticles embedded into a semiconductive matrix represent a promising material for widely sought advanced technological applications. We focused our interest on the preparation of TiO2 matrix with embedded Cu nanoparticles. In particular, we studied the effect of reactive discharge (Ar/O2) exposition on copper oxidation, which can result in two stable forms. Workplace Institute of Physics Contact Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579 Year of Publishing 2020 Electronic address https://doi.org/10.1016/j.tsf.2015.07.026
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