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Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO.sub.2./sub. matrix

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    SYSNO ASEP0510812
    Document TypeJ - Journal Article
    R&D Document TypeJournal Article
    Subsidiary JČlánek ve WOS
    TitleOxidation behavior of Cu nanoparticles embedded into semiconductive TiO2 matrix
    Author(s) Straňák, V. (CZ)
    Drache, S. (DE)
    Wulff, H. (DE)
    Hubička, Zdeněk (FZU-D) RID, ORCID, SAI
    Tichý, M. (CZ)
    Kruth, A. (DE)
    Helm, Ch.A. (DE)
    Hippler, R. (DE)
    Number of authors8
    Source TitleThin Solid Films. - : Elsevier - ISSN 0040-6090
    Roč. 589, Aug (2015), s. 864-871
    Number of pages8 s.
    Languageeng - English
    CountryCH - Switzerland
    Keywordscopper ; nanocomposite ; nanoparticles ; oxidation ; sputtering ; titanium dioxide matrix
    Subject RIVBL - Plasma and Gas Discharge Physics
    OECD categoryFluids and plasma physics (including surface physics)
    R&D ProjectsGAP108/12/2104 GA ČR - Czech Science Foundation (CSF)
    Method of publishingLimited access
    Institutional supportFZU-D - RVO:68378271
    UT WOS000360320000136
    EID SCOPUS84940062502
    DOI10.1016/j.tsf.2015.07.026
    AnnotationMetal nanoparticles embedded into a semiconductive matrix represent a promising material for widely sought advanced technological applications. We focused our interest on the preparation of TiO2 matrix with embedded Cu nanoparticles. In particular, we studied the effect of reactive discharge (Ar/O2) exposition on copper oxidation, which can result in two stable forms.
    WorkplaceInstitute of Physics
    ContactKristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
    Year of Publishing2020
    Electronic addresshttps://doi.org/10.1016/j.tsf.2015.07.026
Number of the records: 1  

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