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Heat conduction in microstructured solids under localised pulse loading
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SYSNO ASEP 0543497 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Heat conduction in microstructured solids under localised pulse loading Author(s) Berezovski, Arkadi (UT-L) Number of authors 1 Source Title Continuum Mechanics and Thermodynamics. - : Springer - ISSN 0935-1175
Roč. 33, č. 6 (2021), s. 2493-2507Number of pages 15 s. Publication form Print - P Language eng - English Country DE - Germany Keywords heat conduction ; microstructured solids ; internal variables Subject RIV BJ - Thermodynamics OECD category Thermodynamics R&D Projects EF15_003/0000493 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) Method of publishing Limited access Institutional support UT-L - RVO:61388998 UT WOS 000658065500001 EID SCOPUS 85107494372 DOI https://doi.org/10.1007/s00161-021-01032-0 Annotation The influence of a microstructure on heat conduction in solids is studied using the internal variable approach. Two variants of the internal variable treatment are compared by means of the numerical simulation of two-dimensional heat conduction in a plate under a localised thermal pulse loading. Computation of the same problem by the different internal variable descriptions produces qualitatively dissimilar results. The single internal variable approach leads to a diffusional type of the internal variable evolution. In contrast, the dual internal variable technique provides a wave-like evolution of the internal variables and, as the consequence, the corresponding wave-like heat transfer. The results are obtained in the dimensionless form, and parameters of models are chosen to emphasise the features of each model. Workplace Institute of Thermomechanics Contact Marie Kajprová, kajprova@it.cas.cz, Tel.: 266 053 154 ; Jana Lahovská, jaja@it.cas.cz, Tel.: 266 053 823 Year of Publishing 2022 Electronic address https://link.springer.com/article/10.1007/s00161-021-01032-0
Number of the records: 1