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Self‐healing epoxy and reversible Diels‐Alder based interpenetrating networks
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SYSNO ASEP 0537725 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Self‐healing epoxy and reversible Diels‐Alder based interpenetrating networks Author(s) Strachota, Beata (UMCH-V) RID
Hodan, Jiří (UMCH-V)
Dybal, Jiří (UMCH-V) RID, ORCID
Matějka, Libor (UMCH-V) RIDArticle number 2000474 Source Title Macromolecular Materials and Engineering. - : Wiley - ISSN 1438-7492
Roč. 306, č. 1 (2021)Number of pages 14 s. Language eng - English Country DE - Germany Keywords dual networks ; interpenetrating networks ; reversible networks Subject RIV CD - Macromolecular Chemistry OECD category Polymer science R&D Projects GA17-13103S GA ČR - Czech Science Foundation (CSF) Method of publishing Limited access Institutional support UMCH-V - RVO:61389013 UT WOS 000592448500001 EID SCOPUS 85096672546 DOI 10.1002/mame.202000474 Annotation Dual networks, containing Diels‐Alder (DA) based reversible and epoxy networks, are studied as self‐healing thermoset materials. The thermoreversible DA network acts as a healing agent at healing procedure and the epoxy network (E) keeps the material integrity. Two types of the dual networks are investigated, the interpenetrating networks (IPN) and the DA‐epoxy copolymers. The rate of bonds breaking and reformation is monitored by Fourier transform infrared spectroscopy and dynamic mechanical analysis. Two healing steps are followed: the sealing of the notch by microscopy and recovery of the structure by tensile tests. The factors governing the healing efficiency are determined and analyzed. The fraction of the sol generated at healing is found to be the crucial parameter. The novel architecture of the IPN with a high content of the DA network is designed. This IPN generates a high amount of the sol at healing and shows the healing efficiency approaching to 100%. Workplace Institute of Macromolecular Chemistry Contact Eva Čechová, cechova@imc.cas.cz ; Tel.: 296 809 358 Year of Publishing 2022 Electronic address https://onlinelibrary.wiley.com/doi/10.1002/mame.202000474
Number of the records: 1