Silicon monocrystal wafers ground with various abrasive materials

Number of the records: 1

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SYSNO ASEP	0356591
Document Type	C - Proceedings Paper (int. conf.)
R&D Document Type	Conference Paper
Title	Silicon monocrystal wafers ground with various abrasive materials
Author(s)	Havelková, Martina (FZU-D)_{RID, ORCID} Hiklová, Helena (FZU-D)_RID
Source Title	SILICON 2010. 12th Scientific and Business Conference. - Rožnov pod Radhoštěm : TECON Scientific, s.r.o., 2010 / Vojtěchovský K. - ISBN 978-80-254-7361-0
Pages	s. 289-290
Number of pages	2 s.
Action	Scientific and Business Conference SILICON 2010 /12./
Event date	02.11.2010-05.11.2010
VEvent location	Rožnov pod Radhoštěm
Country	CZ - Czech Republic
Event type	EUR
Language	eng - English
Country	CZ - Czech Republic
Keywords	silicon monocrystal ; abrasive materials
Subject RIV	BM - Solid Matter Physics ; Magnetism
R&D Projects	1M06002 GA MŠMT - Ministry of Education, Youth and Sports (MEYS)
	KAN301370701 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
CEZ	AV0Z10100522 - FZU-D (2005-2011)
Annotation	The paper describes measuring of silicon wafers surface. Row of samples were made for different purposes in Themis (Rožnov pod Radhoštěm). The measuring were done with Form Talysurf Series 2 apparatus and the dependence on different conditions of cutting and grinding were monitored.
Workplace	Institute of Physics
Contact	Kristina Potocká, potocka@fzu.cz, Tel.: 220 318 579
Year of Publishing	2011

Number of the records: 1