Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction

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SYSNO	0353414
Title	Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction
Author(s)	Man, O. (CZ) Pantělejev, L. (CZ) Kunz, Ludvík (UFM-A)_{RID, ORCID}
Source Title	Materials Transactions. Roč. 51, č. 2 (2010), s. 209-213. - : Japan Institute of Metals and Materials
Document Type	Článek v odborném periodiku
Grant	1QS200410502 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR)
CEZ	AV0Z20410507 - UFM-A (2005-2011)
Language	eng
Country	JP
Keywords	ultra-fine grained copper * thermal stability of microstructure * electron back scattering diffraction * grain size * texture
Permanent Link	http://hdl.handle.net/11104/0192669

Number of the records: 1