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Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction
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SYSNO ASEP 0353414 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Článek ve WOS Title Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction Author(s) Man, O. (CZ)
Pantělejev, L. (CZ)
Kunz, Ludvík (UFM-A) RID, ORCIDNumber of authors 3 Source Title Materials Transactions. - : Japan Institute of Metals and Materials - ISSN 1345-9678
Roč. 51, č. 2 (2010), s. 209-213Number of pages 5 s. Language eng - English Country JP - Japan Keywords ultra-fine grained copper ; thermal stability of microstructure ; electron back scattering diffraction ; grain size ; texture Subject RIV JG - Metallurgy R&D Projects 1QS200410502 GA AV ČR - Academy of Sciences of the Czech Republic (AV ČR) CEZ AV0Z20410507 - UFM-A (2005-2011) UT WOS 000276538900003 DOI 10.2320/matertrans.MC200909 Annotation Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180°C. The dwell times were in the range of 10 to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1°. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing. Workplace Institute of Physics of Materials Contact Yvonna Šrámková, sramkova@ipm.cz, Tel.: 532 290 485 Year of Publishing 2011
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