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Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction
- 1.Man, O., Pantělejev, L., Kunz, L. Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction. Materials Transactions. 2010, 51(2), 209-213. ISSN 1345-9678. E-ISSN 1347-5320. Available: doi: 10.2320/matertrans.MC200909
Number of the records: 1