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Growth and Modification of Organosilicon FIlms in PECVD and Remote Afterglow Reactors
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SYSNO ASEP 0032069 Document Type J - Journal Article R&D Document Type Journal Article Subsidiary J Ostatní články Title Growth and Modification of Organosilicon FIlms in PECVD and Remote Afterglow Reactors Title Růst a modifikace organosilikonových vrstev v plasmatických reaktorech Author(s) Supiot, P. (FR)
Vivien, C. (FR)
Macková, Anna (UJF-V) RID, ORCID, SAI
Granier, A. (FR)
Escaich, D. (FR)
Bousquet, A. (FR)
Clergereaux, R. (FR)
Raynaud, P. (FR)
Strýhal, Z. (CZ)
Pavlík, J. (CZ)Source Title Plasma Processes and Polymers. - : Wiley - ISSN 1612-8850
Roč. 3, č. 2 (2006), s. 100-109Number of pages 10 s. Language eng - English Country DE - Germany Keywords FT-IR ; organosilicon precursors ; plasma polymerisation Subject RIV BL - Plasma and Gas Discharge Physics R&D Projects OC 527.100 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) 1P05OC014 GA MŠMT - Ministry of Education, Youth and Sports (MEYS) CEZ AV0Z90610521 - UJC-A (2005-2011) Annotation Five hundred nanometer thick organosilicon coatings are prepared on Si substrates in parallel by the plasma-assisted polymerisation of hexamethyldisiloxane (HMDSO) in an RF-inductively coupled plasma (RFICP) and distributed electron cyclotron resonance plasma (DECRP) at low pressure (0.27 Pa) and of tetramethyldisiloxane (TMDSO) premixed with oxygen in an N-2 microwave induced remote afterglow (MIRA) at 560 Pa. The structure of these different films is analyzed by different techniques, such as Fourier-transform infrared spectroscopy, Rutherford backscattering spectrometry, atomic force microscopy, ellipsometry, and contact angle measurements. Results of the film composition (at least 30% carbon content), optical properties, and morphology indicate a low cross-linking degree accompanied by short chain length for RFICP and DECRP films, in contrast to a high-molecular-weight structure observed for the MIRA film. Workplace Nuclear Physics Institute Contact Markéta Sommerová, sommerova@ujf.cas.cz, Tel.: 266 173 228 Year of Publishing 2006
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