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Multi-SWD plasma jet system for PECVD deposition of thin films

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    0438735 - FZÚ 2015 RIV US eng J - Journal Article
    Olejníček, Jiří - Čada, Martin - Šmíd, Jiří - Kment, Štěpán - Hubička, Zdeněk
    Multi-SWD plasma jet system for PECVD deposition of thin films.
    IEEE Transactions on Plasma Science. Roč. 42, č. 10 (2014), s. 2502-2503. ISSN 0093-3813. E-ISSN 1939-9375
    R&D Projects: GA TA ČR TA01011740; GA MŠMT LH12045
    Grant - others:AVČR(CZ) M100101215
    Institutional support: RVO:68378271
    Keywords : nuclear and plasma sciences * plasma applications * plasma devices * plasmas
    Subject RIV: BL - Plasma and Gas Discharge Physics
    Impact factor: 1.101, year: 2014

    Multiplasma jet surface-wave discharge launched by the surfatron is a promising PECVD tool for scalable deposition of various semiconductor materials. The timeresolved Langmuir probe study revealed that the plasma plume is inhomogeneous toward the substrate. In the measured interval, the electron energy and the plasma density increased with distance from the nozzle outlet. These findings allowed us to optimize the substrate position during the deposition process.
    Permanent Link: http://hdl.handle.net/11104/0242111

     
     
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