3D analysis of microstructure changes occurring during creep tests of ultra-fine grained materials

0435649 - ÚFM 2015 RIV CH eng C - Conference Paper (international conference)
Král, Petr - Dluhoš, J. - Peřina, P. - Barták, T.
3D analysis of microstructure changes occurring during creep tests of ultra-fine grained materials.
Recrystallization and Grain Growth V. Stafa-Zurich: Trans Tech Publications, 2013 - (Barnett, M.), s. 46-49. Materials Science Forum, 753. ISBN 978-3-03785-688-8. ISSN 0255-5476.
[ReX&GG V - International Conference on Recrystallization and Grain Growth /5/. Sydney (AU), 05.05.2013-10.05.2013]
Institutional support: RVO:68081723
Keywords : Recrystallization * ECAP * Creep * 3D EBSD * Focused Ion Beam
Subject RIV: JJ - Other Materials

Experiments were conducted to determine microstructure changes occurring during thermal exposure in metals processed by equal-channel angular pressing (ECAP). The ECAP pressing was performed at room temperature by route B-c. Static annealing and constant load creep tests in tension were conducted at 0.3-0.5 T-m. The microstructure was examined by scanning electron microscope combined with focus ion beam - TESCAN LYRA 3 equipped with electron back scatter diffraction (EBSD).
Permanent Link: http://hdl.handle.net/11104/0239454