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Differential conductometry biosensors prepared by lift-off technique by using of e-beam writer with shaped beam

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    0429465 - ÚPT 2015 GB eng A - Abstract
    Krátký, Stanislav - Kolařík, Vladimír - Urbánek, Michal - Matějka, Milan - Horáček, Miroslav - Chlumská, Jana - Neděla, Vilém - Jaffrezic-Renault, N. - Krejčí, J. - Kučerová, R. - Plička, R. - Krejčí, T.
    Differential conductometry biosensors prepared by lift-off technique by using of e-beam writer with shaped beam.
    39th International Conference on Micro and Nano Engineering MNE2013. Book of Abstracts. Cambridge: University of Cambridge, 2013. s. 387.
    [MNE2013. International Conference on Micro and Nano Engineering /39./. 16.09.2013-19.09.2013, London]
    Institutional support: RVO:68081731
    Keywords : differential conductometry biosensor * electron-beam lithography * microorganism detection
    Subject RIV: JA - Electronics ; Optoelectronics, Electrical Engineering

    This contribution deals with a manufacturing of differential conductometry biosensors. The active area of the sensors is made of large-area interdigitated array (IDA) gold electrodes. The IDA is prepared by e-beam writer with shaped beam. DNA sensors and microorganism detection requires appropriately designed structures with characteristic dimension up to hundreds of nm. The main goal of this contribution focuses on the IDA fabrication using electron beam lithography and additional technologies. Besides the main technology process, testing of the sensors, packaging and differential conductometry analysis is included. E-beam writer BS600 with shaped beam was used to generate desired pattern of IDA. IDA area wasThis contribution deals with a manufacturing of differential conductometry biosensors. The active area of the sensors is made of large-area interdigitated array (IDA) gold electrodes. The IDA is prepared by e-beam writer with shaped beam. DNA sensors and microorganism detection requires appropriately designed structures with characteristic dimension up to hundreds of nm. The main goal of this contribution focuses on the IDA fabrication using electron beam lithography and additional technologies. Besides the main technology process, testing of the sensors, packaging and differential conductometry analysis is included.
    Permanent Link: http://hdl.handle.net/11104/0234577

     
     
Number of the records: 1