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Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders
- 1.0382341 - ÚFM 2013 RIV CZ eng J - Journal Article
Buršík, Jiří - Buršíková, V. - Pešina, Z. - Sopoušek, J.
Mechanical properties and microstructure of model lead-free joints for electronics made with use of nanopowders.
Chemické listy. Roč. 106, SI (2012), s390-s392. ISSN 0009-2770. E-ISSN 1213-7103.
[Local Mechanical Properties 2011. Olomouc, 09.11.2011-11.11.2011]
R&D Projects: GA ČR(CZ) GA106/09/0700
Institutional research plan: CEZ:AV0Z20410507
Keywords : solder * silver nanopowdwer * nanoindentation
Subject RIV: JG - Metallurgy
Impact factor: 0.453, year: 2012
In this work, Ag nanopowders were prepared as potential low-toxic constituens of novel solders by a chemical wet synthesis with the aim to study the effect of melting temperature depression and to evaluate the mechanical properties of sintered layers prepared in various annealing regimes.
Permanent Link: http://hdl.handle.net/11104/0212585
Number of the records: 1