Microstructural stability of ultrafine grained copper at elevated temperature

0366907 - ÚFM 2012 RIV SK eng J - Journal Article
Pantělejev, L. - Man, O. - Kunz, Ludvík
Microstructural stability of ultrafine grained copper at elevated temperature.
Acta Metallurgica Slovaca. - (Longauerová, M.). Roč. 17, č. 3 (2011), s. 158-162. ISSN 1338-1156
Institutional research plan: CEZ:AV0Z20410507
Keywords : ultrafine grained microstructure * copper * microstructurral stability * EBSD
Subject RIV: JG - Metallurgy

Thermal stability of ultrafine grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at temperature range from 180 °C to 300 °C in a tube furnace under argon as a protecting gas. The dwell times were in the range from 10 min to 300 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the changes of UFG structure. More advanced analysis of the EBSD results based on kernel average misorientation (KAM) parameter was performed.
Permanent Link: http://hdl.handle.net/11104/0201736