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Silicon monocrystal wafers ground with various abrasive materials
- 1.0356591 - FZÚ 2011 RIV CZ eng C - Conference Paper (international conference)
Havelková, Martina - Hiklová, Helena
Silicon monocrystal wafers ground with various abrasive materials.
SILICON 2010. 12th Scientific and Business Conference. Rožnov pod Radhoštěm: TECON Scientific, s.r.o., 2010 - (Vojtěchovský, K.), s. 289-290. ISBN 978-80-254-7361-0.
[Scientific and Business Conference SILICON 2010 /12./. Rožnov pod Radhoštěm (CZ), 02.11.2010-05.11.2010]
R&D Projects: GA MŠMT(CZ) 1M06002; GA AV ČR KAN301370701
Institutional research plan: CEZ:AV0Z10100522
Keywords : silicon monocrystal * abrasive materials
Subject RIV: BM - Solid Matter Physics ; Magnetism
The paper describes measuring of silicon wafers surface. Row of samples were made for different purposes in Themis (Rožnov pod Radhoštěm). The measuring were done with Form Talysurf Series 2 apparatus and the dependence on different conditions of cutting and grinding were monitored.
Permanent Link: http://hdl.handle.net/11104/0006343
Number of the records: 1