Microstructure of the ultra-fine grained Cu by UHV SLEEM

0335272 - ÚPT 2010 RIV AT eng C - Conference Paper (international conference)
Mikmeková, Šárka - Hovorka, Miloš - Müllerová, Ilona - Frank, Luděk - Man, O. - Pantělejev, L.
Microstructure of the ultra-fine grained Cu by UHV SLEEM.
MC 2009 - Microscopy Conference: First Joint Meeting of Dreiländertagung and Multinational Conference on Microscopy. Graz: Verlag der Technischen Universität, 2009, Vol. 3: 515-516. ISBN 978-3-85125-062-6.
[MC 2009 - Joint Meeting of Dreiländertagung and Multinational Congress on Microscopy /9./. Graz (AT), 30.08.2009-04.09.2009]
R&D Projects: GA MŠMT OE08012
Institutional research plan: CEZ:AV0Z20650511
Keywords : scanning low energy electron microscopy * EBSD * grain contrast in SEM * ultrafine grained materials
Subject RIV: JA - Electronics ; Optoelectronics, Electrical Engineering
http://www.univie.ac.at/asem/Graz_MC_09/papers/25482.pdf

Study of materials with ultra-fine structure belongs nowadays to fronted areas of research of the material engineering. Ultra-fine grained (UFG) materials are defined as polycrystals with very small grains of average grain sizes below 1 micrometer. These materials are very attractive for many industrial applications (including aerospace, automotive, biomaterials, chemical sensors, construction, electronics, metal forming, etc.) because of their interesting mechanical and physical properties surpassing those of common materials. The superior mechanical properties include ultra high strength and superplasticity.
Permanent Link: http://hdl.handle.net/11104/0179781