Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding

0575225 - FZÚ 2024 RIV GB eng J - Journal Article
Hlushko, K. - Ziegelwanger, T. - Reisinger, M. - Todt, J. - Meindlhumer, M. - Beuer, S. - Rommel, M. - Greving, I. - Flenner, S. - Kopeček, Jaromír - Keckes, J. - Detlefs, C. - Yildirim, C.
Intragranular thermal fatigue of Cu thin films: Near-grain boundary hardening, strain localization and voiding.
Acta Materialia. Roč. 253, July (2023), č. článku 118961. ISSN 1359-6454. E-ISSN 1873-2453
R&D Projects: GA MŠMT(CZ) EF16_019/0000760
Grant - others:OP VVV - SOLID21(XE) CZ.02.1.01/0.0/0.0/16_019/0000760
Research Infrastructure: CzechNanoLab II - 90251
Institutional support: RVO:68378271
Keywords : copper * dark field X-ray microscopy * residual stress * tThermal fatigue * tThin film
OECD category: Condensed matter physics (including formerly solid state physics, supercond.)
Impact factor: 9.4, year: 2022
Method of publishing: Open access

In order to obtain a fundamental understanding of the phenomena accompanying thermomechanical fatigue of Cu metallization used in power electronics, as well as the resulting deterioration of electric properties, there is a need to assess intragranular microstructure and strain evolution within individual Cu grains and near grain boundaries. Here, synchrotron dark field X-ray microscopy (DFXM) is used to characterize as-deposited and 5 × 104 times thermally-cycled 20 μm thick Cu films. The cycling was performed using a dedicated test chip in the range of 100–400 ◦C applying a heating rate of 106 K/s.
Permanent Link: https://hdl.handle.net/11104/0349368