Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films

0572409 - FZÚ 2024 RIV NL eng J - Journal Article
Antony, A. - Hejduk, M. - Hrbek, T. - Kúš, P. - Bičišťová, Radka - Hauschwitz, Petr - Cvrček, L.
Laser-assisted two-step glass wafer metallization: An experimental procedure to improve compatibility between glass and metallic films.
Applied Surface Science. Roč. 627, Aug. (2023), č. článku 157276. ISSN 0169-4332. E-ISSN 1873-5584
R&D Projects: GA MŠMT EF15_006/0000674
Grant - others:OP VVV - HiLASE-CoE(XE) CZ.02.1.01/0.0/0.0/15_006/0000674
Institutional support: RVO:68378271
Keywords : glass * glass metallization * laser treatment * surface adhesion * microstructure
OECD category: Optics (including laser optics and quantum optics)
Impact factor: 6.7, year: 2022
Method of publishing: Limited access
https://doi.org/10.1016/j.apsusc.2023.157276

We report a simple and efficient two-step experimental procedure of glass metallization using laser microstructuring at ambient conditions. An adhesive pattern was created on the glass substrate using a laser, which imposes mechanical interlocking. An adhesive Cu layer was deposited on the glass substrate by magnetron sputtering and then electroplated with a functional Cu layer. Due to the unique surface structure created on the glass using laser, we achieved a thick layer of Cu metal film with high adhesion strength, well-defined grains and grain boundaries, and low surface roughness. The total thickness of the grown film was 11.4 µm, with an average surface roughness of 1.2 µm. The magnetron-sputtered coating did not show delamination from the glass substrate at a critical load of 60 N. The proposed method of glass metallization will lead to the realization of glass-based circuit materials that can be used in high-frequency electronic devices. Also, this procedure will be an alternative to chemical-based copper plating, which involves multiple processing steps and high-cost chemicals.
Permanent Link: https://hdl.handle.net/11104/0352238