Low conductive thermal insulation pad with high mechanical stiffness

0568471 - ÚPT 2023 CZ eng A - Abstract
Hanzelka, Pavel - Dupák, Libor - Krutil, Vojtěch - Krzyžánek, Vladislav - Skoupý, Radim - Srnka, Aleš - Vlček, Ivan - Urban, Pavel
Low conductive thermal insulation pad with high mechanical stiffness.
16th Multinational Congress on Microscopy, 16MCM, 04-09 September 2022, Brno, Czech Republic. Book of abstracts. Brno: Czechoslovak Microscopy Society, 2022 - (Krzyžánek, V.; Hrubanová, K.; Hozák, P.; Müllerová, I.; Šlouf, M.). s. 152-153. ISBN 978-80-11-02253-2.
[Multinational Congress on Microscopy /16./. 04.09.2022-09.09.2022, Brno]
R&D Projects: GA TA ČR TE01020233
Institutional support: RVO:68081731
Keywords : Cryogenics * Thermal insulation * Microscopy * Sample holder
OECD category: Thermodynamics
https://www.16mcm.cz/wp-content/uploads/2022/09/16MCM-abstract-book.pdf

Thermal conductivity and mechanical stiffness of sample holder mounting are two key properties that together affect the imaging quality of the scanning probe microscopes (SPM). Here we
present the design of a thermal insulation pad (InBallPad), characterized by low thermal conductivity and high mechanical stiffness, for mounting of the sample holder of an ultra-high
vacuum SPM. The SPM operate at variable temperatures of the sample holder in the range of 20 K - 700 K. IBP is mounted between the upper plate of a piezoelectric scanner and the bottom of the sample holder. InBallPad consists of a top and bottom plate made of titanium alloy that are mutually separated by three specially designed ball supports. The design of ball supports is based on traditional kinematic couplings, called Kelvin Coupling, with three different types of bearings: tetrahedron, V-groove, flat plane. The sample holder with variable temperature is mounted on the top plate whereas the bottom plate serves for mechanical connection to the piezoelectric scanner of SPM with approximately room temperature. The main characteristics of IBP can be summarized as follow: Low thermal conductivity, High mechanical stiffness, Small dimensions and mass.
Permanent Link: https://hdl.handle.net/11104/0339783