Special Issue Featuring Papers from the International Thermal Spray Conference (ITSC) 2021

0555546 - ÚFP 2023 RIV US eng O - Others
McDonald, A. - Azarmi, F. - Balani, K. - Čížek, Jan - Koivuluoto, H. - Lau, Y. - Li, H. - Toma, F.
Special Issue Featuring Papers from the International Thermal Spray Conference (ITSC) 2021.
2022. Journal of Thermal Spray Technology. Springer. Roč. 31, č. 1-2 (2022), s. 3-4. ISSN 1059-9630. E-ISSN 1544-1016
Institutional support: RVO:61389021
Keywords : thermal spray * conference * materials
OECD category: Materials engineering
https://link.springer.com/article/10.1007/s11666-022-01326-y

The COVID-19 pandemic and government restrictions continued to have marked impact on the delivery of the flagship International Thermal Spray Conference. As a result, the International Thermal Spray Conference 2021 (ITSC 2021) was delivered via a virtual platform. Conference manuscripts were submitted, and this special issue of the Journal of Thermal Spray Technology (JTST) presents a selection of those manuscripts expanded into full-length, peer-reviewed articles. The conference was held May 24–28, 2021, and was organized by the ASM International Thermal Spray Society (TSS).
Permanent Link: https://hdl.handle.net/11104/0341082