TEM and Synchrotron X-ray Study of the Evolution\nof Phases Formed During Bonding of IN718/Al/IN718\nCouples by TLPB

0540642 - ÚFM 2022 RIV US eng J - Journal Article
Polisperi, M. - Barriobero-Vila, P. - Requena, G. - Garcia, L. N. - Tolley, A. - Poletti, A. - Vojtek, Tomáš - Weiser, Adam - Schell, N. - Stark, A. - Boeri, R. - Sommadossi, S.
TEM and Synchrotron X-ray Study of the Evolution
of Phases Formed During Bonding of IN718/Al/IN718
Couples by TLPB.
Metallurgical and Materials Transactions A. Roč. 52, č. 4 (2021), s. 1382-1394. ISSN 1073-5623. E-ISSN 1543-1940
Institutional support: RVO:68081723
Keywords : Aluminum * Aluminum alloys * Binary alloys * Chemical bonds * Crystal structure * Growth kinetics * Growth rate * Nickel metallography * Rate constants
OECD category: Materials engineering
Impact factor: 2.726, year: 2021
Method of publishing: Limited access
https://link.springer.com/article/10.1007%2Fs11661-021-06159-y

This study investigates the microstructure across the interconnection zone of IN718/Al/IN718
couples obtained by the Transient Liquid Phase Bonding (TLPB) process at temperatures
ranging from 800 C to 1000 C. The crystal structure and the chemical composition of the
phases formed, including the AlNi intermetallic, were evaluated using TEM-EDS. The evolution
of the AlNi layer as a function of bonding time was studied by in situ high energy synchrotron
x-ray diffraction. The AlNi lattice parameter increases up to 2.9401 A˚ and subsequently
decreases with the annealing time due to changes in the chemical composition of AlNi. This
behavior is related to the formation of two distinct layers of AlNi: Al-rich AlNi and Ni-rich
AlNi. The split of the AlNi phase indicates that a chemical partition takes place when Ni and Al
atomic concentrations are approximately equal. The growth kinetics of both layers are
controlled by diffusion with different growth rate constants. These results contribute to the
understanding of the solid-state transformations occurring in a multicomponent and multilayered TLP bond under isothermal conditions
Permanent Link: http://hdl.handle.net/11104/0322419