Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO.sub.2./sub. matrix

0510812 - FZÚ 2020 RIV CH eng J - Journal Article
Straňák, V. - Drache, S. - Wulff, H. - Hubička, Zdeněk - Tichý, M. - Kruth, A. - Helm, Ch.A. - Hippler, R.
Oxidation behavior of Cu nanoparticles embedded into semiconductive TiO₂ matrix.
Thin Solid Films. Roč. 589, Aug (2015), s. 864-871. ISSN 0040-6090. E-ISSN 1879-2731
R&D Projects: GA ČR GAP108/12/2104
Institutional support: RVO:68378271
Keywords : copper * nanocomposite * nanoparticles * oxidation * sputtering * titanium dioxide matrix
OECD category: Fluids and plasma physics (including surface physics)
Impact factor: 1.761, year: 2015
Method of publishing: Limited access
https://doi.org/10.1016/j.tsf.2015.07.026

Metal nanoparticles embedded into a semiconductive matrix represent a promising material for widely sought advanced technological applications. We focused our interest on the preparation of TiO2 matrix with embedded Cu nanoparticles. In particular, we studied the effect of reactive discharge (Ar/O2) exposition on copper oxidation, which can result in two stable forms.
Permanent Link: http://hdl.handle.net/11104/0301188