Transcriptomic Response of Arabidopsis thaliana Exposed to CuO Nanoparticles, Bulk Material, and Ionic Copper

0479928 - ÚEB 2018 RIV US eng J - Journal Article
Landa, Přemysl - Dytrych, Pavel - Přerostová, Sylva - Petrová, Šárka - Vaňková, Radomíra - Vaněk, Tomáš
Transcriptomic Response of Arabidopsis thaliana Exposed to CuO Nanoparticles, Bulk Material, and Ionic Copper.
Environmental Science and Technology. Roč. 51, č. 18 (2017), s. 10814-10824. ISSN 0013-936X. E-ISSN 1520-5851
R&D Projects: GA MŠMT LD14125; GA MŠMT 8G15003
Institutional support: RVO:61389030 ; RVO:67985858
Keywords : METAL-OXIDE NANOPARTICLES * GENE-EXPRESSION * JASMONIC ACID
OECD category: Plant sciences, botany; Chemical process engineering (UCHP-M)
Impact factor: 6.653, year: 2017

Engineered nanoparticles (ENPs) exhibit unique properties advantageous in a number of applications, but they also represent potential health and environmental risks. In this study, we investigated the phytotoxic mechanism of CuO ENPs using transcriptomic analysis and compared this response with the response to CuO bulk particles and ionic Cu 2+ . Ionic Cu 2+ at the concentration of 0.16 mg L1 changed transcription of 2692 genes (p value of < 0.001, fold change of ≥2) after 7 days of exposure, whereas CuO ENPs and bulk particles (both in the concentration of 10 mg L1 ) altered the expression of 922 and 482 genes in Arabidopsis thaliana roots, respectively. The similarity between transcription profiles of plants exposed to ENPs and ionic Cu 2+ indicated that the main factor in phytotoxicity was the release of Cu 2+ ions from CuO ENPs after 7 days of exposure. The effect of Cu 2+ ions was evident in all treatments, as indicated by the down-regulation of genes involved in metal homeostasis and transport and the up-regulation of oxidative stress response genes. ENPs were more soluble than bulk particles, resulting in the up-regulation of metallochaperone-like genes or the down-regulation of aquaporins and metal transmembrane transporters that was also characteristic for ionic Cu 2+ exposure.
Permanent Link: http://hdl.handle.net/11104/0275842