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Fine smoothing of conductive substrate for Permalloy layer electroplating
- 1.0439617 PL eng C - Conference Paper (international conference)
Butta, M. - Janosek, M. - Pilarcikova, I. - Kraus, Luděk
Fine smoothing of conductive substrate for Permalloy layer electroplating.
Acta Physica Polonica A, vol. 126, 2014, č. 1. Warsaw: Polish Academy of Sciences, 2014, s. 150-151. ISSN 0587-4246. E-ISSN 1898-794X
R&D Projects: GA ČR GAP102/12/2177
Institutional support: RVO:68378271
Keywords : copper * electrolytic polishing * electroplating * nickel alloys conductive substrates * copper substrates * Fe-Ni films * gas evolution
In this paper we study the in
Permanent Link: http://hdl.handle.net/11104/0242907
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