Reducing the Edge Chipping for Capillary End Face Grinding and Polishing

0394239 - ÚT 2014 RIV CZ eng C - Conference Paper (international conference)
Hošek, Jan - Studenovský, K.
Reducing the Edge Chipping for Capillary End Face Grinding and Polishing.
OaM 2012 : Optics and Measurement : International conference. Liberec: Institute of Plasma Physics AS CR, v v. i, 2012 - (Vít, T.; Kovačičinová, J.; Lédl, V.), s. 1-4. ISBN 978-80-87026-02-1.
[OaM 2012. Liberec (CZ), 16.10.2012-18.10.2012]
R&D Projects: GA AV ČR IAA200760905
Institutional support: RVO:61388998
Keywords : edge chipping * grinding * polishing
Subject RIV: JR - Other Machinery
http://epjwoc.epj.org/articles/epjconf/abs/2013/09/epjconf_OAM2012_00005/epjconf_OAM2012_00005.html

This paper presents results of glass capillary end face grinding and polishing by approach that reduces the edge chipping. Brittle materials have natural tendency for edge chipping what leads to beveling the sharp edges. Not beveled sharp edges on glass capillary are important for special applications like surface tension measurement of small liquid samples. We use common grinding and polishing process for capillary end face machining modified with gradual decreasing of grinding load based on the relation of the critical chipping load. Achieved surface roughness is measured using atomic force microscopy (AFM). Capillary inner edge quality is checked both with optical microscopes and electron microscope too. We achieved a non-chipped capillary inner edge with radius down to 100 nm.
Permanent Link: http://hdl.handle.net/11104/0223466