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Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition
- 1.0368128 - ÚFM 2012 RIV GB eng J - Journal Article
Kunz, Ludvík - Lukáš, Petr - Pantělejev, L. - Man, O.
Stability of Microstructure of Ultrafine-Grained Copper Under Fatigue and Thermal Exposition.
Strain. Roč. 2011, č. 47 (2011), 476–482. ISSN 0039-2103. E-ISSN 1475-1305
Institutional research plan: CEZ:AV0Z20410507
Keywords : equal channel angular pressing * stability of ultrafine-grained microstructure * fatigue
Subject RIV: JG - Metallurgy
Impact factor: 1.103, year: 2011
Effect of cyclic loading and thermal exposition on microstructure of bulk ultrafinegrained Cu prepared by equal channel angular pressing was experimentally investigated by means of electron backscattering diffraction and by transmission electron microscopy. Stability of the microstructure under stress-controlled cyclic loading with a tensile mean stress of 200 MPa was shown to be high. Neither dynamic grain coarsening nor development of bimodal microstructure was observed. However, annealing at 250 °C for 30 min resulted in formation of bimodal microstructure. Consequently, fatigue strength of annealed specimens was low.
Permanent Link: http://hdl.handle.net/11104/0006707
Number of the records: 1