Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction

0353414 - ÚFM 2011 RIV JP eng J - Journal Article
Man, O. - Pantělejev, L. - Kunz, Ludvík
Study of thermal stability of ultrafine-grained copper by means of electron back scattering diffraction.
Materials Transactions. Roč. 51, č. 2 (2010), s. 209-213. ISSN 1345-9678. E-ISSN 1347-5320
R&D Projects: GA AV ČR 1QS200410502
Institutional research plan: CEZ:AV0Z20410507
Keywords : ultra-fine grained copper * thermal stability of microstructure * electron back scattering diffraction * grain size * texture
Subject RIV: JG - Metallurgy
Impact factor: 0.779, year: 2010

Thermal stability of ultrafine-grained (UFG) structure of 99.9% pure copper produced by eight equal channel angular pressing (ECAP) passes was studied. The annealing experiments were conducted at 180°C. The dwell times were in the range of 10 to 120 min. The electron backscattering diffraction (EBSD) analyses were performed before and after annealing at exactly the same area in order to quantify the degree of decomposition of the UFG structure. Definition of grain boundaries was based on the misorientation angle of 1°. More advanced analysis of the EBSD results based on a kernel average misorientation (KAM) parameter was performed. Inverse pole figure maps did not reveal any substantial changes of UFG microstructure due to annealing. Some shift in the KAM modus in comparison with the initial state was observed but its magnitude was found negligible. Also changes in texture were found to be minor. On the other hand the microhardness increases with increasing time of annealing.
Permanent Link: http://hdl.handle.net/11104/0192669