Number of the records: 1  

Self-Assembly of Lamellar- and Cylinder-Forming Diblock Copolymers in Nanoslits: Insight from Dissipative Particle Dynamics Simulations

  1. 1.
    0345238 - ÚCHP 2011 SK eng C - Conference Paper (international conference)
    Petrus, P. - Lísal, Martin - Škvor, J.
    Self-Assembly of Lamellar- and Cylinder-Forming Diblock Copolymers in Nanoslits: Insight from Dissipative Particle Dynamics Simulations.
    Proceedings. Bratislava: Slovak University of Technology, 2010 - (Markoš, J.), s. 171. ISBN 978-80-227-3290-1.
    [International Conference of Slovak Society of Chemical Engineering /37./. Tatranské Matliare (SK), 24.05.2010-28.05.2010]
    Grant - others:UJEP(CZ) 5322415000801
    Institutional research plan: CEZ:AV0Z40720504
    Keywords : diblock copolymers * slit walls * interfacial interactions
    Subject RIV: CF - Physical ; Theoretical Chemistry

    In the bulk, diblock copolymers self-assemble into lamellar, cylindrical, gyroid and micellar nanostructures depending on the chemical incompatibility between the copolymer blocks and the block lengths ratio. However, in confinement interfacial interactions, symmetry breaking, structural frustration, and confinement-induced entropy loss play a determining role which lead to nanostructures that differ from those found in bulk. One key challenge in nanotechnology is to manipulate structures from the bottom-up, which could lead to novel materials of unique properties. In this study, the dissipative particle dynamics method is used to simulate the formation of nanostructures for lamellar- and cylinder-forming diblock copolymers between two planar surfaces. The formation of the diblock-copolymer nanostructures between the planar surfaces is investigated and characterized by varying the separation width and the strength of the interaction between the diblock copolymers and slit walls.
    Permanent Link: http://hdl.handle.net/11104/0186554

     
     
Number of the records: 1  

  This site uses cookies to make them easier to browse. Learn more about how we use cookies.