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Low Temperature Plasma Enhanced Chemical Vapour Deposition (PECVD) of TiN on Si Substrates
- 1.0179279 - UFP-V 20030158 CZ eng A - Abstract
Nohava, Jiří - Jedrzejowski, P.
Low Temperature Plasma Enhanced Chemical Vapour Deposition (PECVD) of TiN on Si Substrates.
Workshop ČVUT 2001. Praha: ČVUT Praha, 2001. s. 458-459. ISBN 80-01-02335-4.
[Workshop ČVUT 2001. 05.02.2001-07.02.2001, Praha]
Institutional research plan: CEZ:AV0Z2043910
Keywords : PECVD, titanum nitride, low temperature
Subject RIV: JK - Corrosion ; Surface Treatment of Materials
Permanent Link: http://hdl.handle.net/11104/0076081
Number of the records: 1