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Copper nitride thin films prepared by the RF plasma chemical reactor with low pressure supersonic single and multi-plasma jet system

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    0132837 - FZU-D 20000090 RIV CH eng J - Journal Article
    Soukup, Ladislav - Šícha, M. - Fendrych, František - Jastrabík, Lubomír - Hubička, Zdeněk - Chvostová, Dagmar - Šíchová, H. - Valvoda, V. - Tarasenko, A. A. - Studnička, Václav - Wagner, T. - Novák, Miloš
    Copper nitride thin films prepared by the RF plasma chemical reactor with low pressure supersonic single and multi-plasma jet system.
    Surface and Coatings Technology. 116-119, - (1999), s. 321-326. ISSN 0257-8972.
    [International Congerence on Plasma Surface Engineering /6./. Garmisch-Partenkirchen, 14.09.1998-18.09.1998]
    R&D Projects: GA AV ČR IPP1067701
    Institutional research plan: CEZ:AV0Z1010914
    Subject RIV: BM - Solid Matter Physics ; Magnetism
    Impact factor: 1.008, year: 1999

    The RF plasma chemical reactor with low pressure superionic plasma jet system has been used for deposition of Cu3N thin films.
    Permanent Link: http://hdl.handle.net/11104/0030834

     
     

Number of the records: 1  

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